Resumo

RAMIREZ-ORTIZ, Jorge et al. Deposición selectiva de cobre utilizando CVD. Rev. Soc. Quím. Méx [online]. 2000, vol.44, n.4, pp.266-269. ISSN 0583-7693.

Chemical Vapor Deposition (CVD) is a technique which has been used successfully for obtaining thin copper metallic films. Additionally, through prior treatment of the substrate, selective deposits can be carried out, that is, coating only the predetermined regions of the substrate. In this work we present the results of the in situ production of seeds made from some metals used successfully in the selective deposition of Cu on silicon wafers.

Palavras-chave : chemical vapor deposition; CVD; selective deposition; copper; films.

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