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Superficies y vacío

versión impresa ISSN 1665-3521

Superf. vacío vol.20 no.1 Ciudad de México mar. 2007

 

Packaging investigation and study for optical interfacing of micro components with optical fibers - Part I

 

Jose Mireles Jr.*, Maribel Gómez, Miguel A. Garcia

 

Centro de Investigación en Ciencia y Tecnología Aplicada (CICTA) de la Universidad Autónoma de Ciudad Juárez, Ave. Del Charro 450 N., Cd. Juárez Chih. MEXICO, CP 32310, *jmireles@uacj.mx

 

Recibido: 17 de diciembre de 2006.
Aceptado: 10 de febrero de 2007.

 

Abstract

An investigation study concerning optical fiber alignment and micro-mirror performance in MOEMS devices is being reviewed in this paper. The central attention of the study is the analysis of optical fibers positioning, alignment, bonding, optical improvements, coupling to micro-lenses for beam collimation and waveguides. Also, we highlight features concerning coupling of optical fibers to micro-mirrors while searching for the proper alignment and characterization of the optical beam reflection, its tolerances, relative positioning, and attachment techniques.

Keywords: Micro Electro Mechanical Systems (MEMS); Packaging; Optical interconnects; Opto Electronics.

 

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References

[1] "Second Edition of International Micro-Nano Roadmap," MANCEF - Micro and Nanotechnology Commercialization Education Foundation, 117 Bryn Mawr Drive SE #27 | Albuquerque, NM 87106 USA.         [ Links ]

[2] Iliescu, C.; Jianmin Miao; Tay, F.E.H. "Low cost wafer level packaging of MEMS devices [piezoresistive pressure sensor example]" Electronics Packaging Technology, 2003 5th Conference, EPTC 2003, 10-12 Dec. 2003.         [ Links ]

[3] Reichl, H.; Grosser, V. "Overview and development trends in the field of MEMS packaging" The 14th IEEE International Conference on Micro Electro Mechanical Systems, 2001. MEMS 2001.         [ Links ]

[4] E. J. Palen "Taking a Photonic Device from Prototype to Manufacturing: Ten Common Pitfalls and How to Avoid Them" Proceedings from IEEE's Photonic Devices & Systems Packaging Symposium (PhoPack), Stanford University, California, July15th-16th, 2002.         [ Links ]

[5] Mireles J., "Packaging Investigation and Study for Optical Interfacing of Micro Components with Optical Fibers" study developed for Sandia Natoinal Labs, document #9602, with PO# 659783. Applied Science and Technology Research Center, Universidad Autonoma de Ciudad Juarez, MX 2007.         [ Links ]

[6] S. Kawai, Editor, "Handbook of Optical Interconnects," Taylor Francis 2005, ISBN: 0-8247-2441-0.[7]         [ Links ] S. Ou, G. Xu, Y. Xu, K.N. Tu "Optical fiber packaging by lead (Pb)-free solder in V-grooves," Ceramics International 30 (2004) 1115-1119.         [ Links ]

[7] Ou, G. Xu, Y. Xu, K.N. Tu, Ceramics International Vol. 30 Issue 7, (2004) p. 1115.         [ Links ]

[8] S.-S. Lee, L.-S. Huang, C.-J. Kim, and M. C. Wu "2x2 MEMS Fiber Optic Switches With Silicon Sub-Mount For Low-Cost Packaging" Solid-State Sensor and Actuator Workshop Hilton Head Island, SC,. 1998.         [ Links ]

[9] L.-S. Huang, S.-S. Lee, E. Motamedi, M. C. Wu and C.-J. Kim "MEMS Packaging for Micro Mirror Switches," 1998 Electronic Components and Technology Conference, IEEE, pp. 592-597.         [ Links ]

[10] D.C. Abeysinghe, V. Ranatunga, A. Balagopal, H. Mu, K. Ye, and D. Klotzkin "A Novel Technique for High-Strength Direct Fiber-to-Si Submount Attachment Using Field-Assisted Anodic Bonding for Optoelectronics Packaging," IEEE Photonics Technology Letters, Vol. 16, No. 9, Sep. 2004.         [ Links ]

[11] G. Wu, A.R. Mirza, S.K. Gamage, L. Ukrainczyk, N. Shashidhar, G. Wruck and M. Ruda. Journal Of Micromechanics And Microengineering, 14 1367 (2004).         [ Links ]

[12] A. L. Glebov, M. G. Lee, and K. Yokouchi. Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, Proc. of SPIE. 6185, 618501. (2006).         [ Links ]

[13] M. Karppinen, T. Alajokia, A. Tanskanena, K. Katajaa, J.-T. Mäkinena, P. Kariojaa, M. Immonenb, J. Kivilahtic, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, Proc. of SPIE 6185, 61850O, (2006).         [ Links ]

[14] M.S. Bakir, P.A. Kohl, A.L. Glebov, E. Elce, D. Bhusari, M.G. Lee, and J.D. Meindl, Photonics Packaging, Integration, and Interconnects VII, Proc. of SPIE 6478, 647802, (2007).         [ Links ]

[15] R. Hauffe, U. Siebel, K. Petermann, R. Moosburger, J-R. Kropp, F. Arndt, 2000 Electronic Components and Technology Conference, IEEE. (2000) p. 238.         [ Links ]

[16] S. J. Adamson, J. J. Klocke, L. Nielson, Pori Engineering Conference 2001. (2001).         [ Links ]

[17] T.Y. Lin, Optical Engineering 46, 1 (2007).         [ Links ]

[18] A. K. Nallani, T. Chen, D. J. Hayes, W.-S. Che, and J.-B. Lee, Journal of Lightwave Technology 24, 1504 (2006).         [ Links ]

[19] U. Gengenbach, Proceedings SPIE 2906, 141 (1996).         [ Links ]

[20] C. Lausch, R. Goering, F. Wippermann, MOEMS and Miniaturized Systems III, Proc. SPIE 4983, 44, 0277-786X/03 (2003)        [ Links ]

[21] T.H. Buckle, Sandia National Laboratories Report SAND93-2478. Albuquerque NM, (1993).         [ Links ]

[22] Y. G. Lee, S. K. Hong, M. Y. Park, S. C. Jung and S. H. Lee, MOEMS and Miniaturized Systems IV, Proceedings of SPIE Vol. 5346, (Bellingham, WA, 2004) p. 160.         [ Links ]

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